More than a decade after the first publications on the topic, it is now well accepted that ALD possesses the unique capability of making the world’s highest performing single layer gas diffusion barriers. Extremely thin ALD barriers have been shown to provide the necessary protection for some of the most sensitive electronics, including CIGS photovoltaics and OLED displays and lighting.
Up until now, the low speed and high cost of traditional pulse-purge ALD have prevented its commercial use in these applications. But now with the demonstrated high speed and low cost of Lotus’ TransFlex and Vortex ALD processes, ALD has become an extremely attractive solution for direct encapsulation of these devices, and for the manufacture of polymer encapsulation films.
Unlike the aluminum oxide based encapsulation solutions offered by our competitors, Lotus’ encapsulation materials and processes have been painstakingly developed over the last decade to overcome the weaknesses of Al2O3. Our patented materials and processes can provide hermetic seals at 1/3 of the thickness required for aluminum oxide, increasing throughput and lowering costs. And our silicate based materials offer unparalleled environmental stability, surviving up to 3000 hours of direct exposure to 85°C and 85% relative humidity, while having no impact on the optical characteristics of the underlying product.
In just a few years after producing the first ALD films with our methods, we’ve reduced coating costs for ultra-barrier films on flexible substrates by two orders of magnitude compared with existing organic/inorganic multi-layer methods. And our Vortex ALD systems can provide direct encapsulation of an entire batch of rigid substrates in just a few minutes.
Our latest barrier materials and processes can even provide a hermetic seal on complicated electronic assemblies in a fraction of the time required for traditional parylene-based conformal coating, and at a fraction of the cost. With our patent pending process, we can even coat these types of substrates without drying them out first, and at temperatures down to room temperature.