Lotus News: Lotus AT's Eric Dickey Presenting at 2024 SVC Tech Con in Chicago, IL on Monday May 6, 2024

To date, scaling of ALD processes to large area substrates, with sufficient throughput rate while still meeting cost requirements, has been elusive. In this work, a novel spatial, plasma-enabled ALD process is demonstrated that offers economic scalability of ALD for large area substrates, such as in the display and photovoltaic applications. This work describes a particular plasma source and precursor separation design that readily enable process scaling. In combination with a mixed oxide barrier material, a process is demonstrated that provides a path for in-line deposition of OLED-quality encapsulation on multi-meter substrates, with takt time of less than one minute.

Monday, May 6, 2024 at 2:10 pm.